BONDERS

Die bonders
EUTECTIC DIE BONDER (model 135)
PICK AND PLACE (model 155)
EPOXY ATTACHER - PICK AND PLACE (model 157)
FLIP CHIP BONDER (model 2000)
MANUAL DIE BONDER (model 235)

Eutectic bonders
EUTECTIC DIE BONDER (model 135)

Epoxy pick and place bonders
EPOXY DISPENSER (model 160)

Flip chip bonder
FLIP CHIP BONDER (model 2000)

Pick and place bonders
PICK AND PLACE (model 155)
EPOXY ATTACHER - PICK AND PLACE (model 157)

Die removal
MANUAL DIE BONDER (model 235)

TOOLS

Lid placement tool
LID PICK-UP AND PLACE TOOL (P/N 600)

Epoxy dispense
EPOXY DISPENSER (model 160)

Solderability dipper
SOLDERABILITY DIPPER (model 188)

TEST EQUIPMENT

Pull tester
WIRE PULLER (model 116)

Lead fatigue/integrity tester
LEAD INTEGRITY TESTER (model 197)

Temperature controller
TEMPERATURE CONTROLLER (model 198)

Heated work stages
HEATED WORK STAGE (model 199)

Work Stages
TEMPERATURE CONTROLLER (model 198)
HEATED WORK STAGE (model 199)

Hot gas rework
HOT GAS REWORK STATION (model 203)

Volume resistivity tester
VOLUME RESISTIVITY TESTER (model 250)

INSPECTION

Wafer inspection
ROMISCOPE

Microscope
MICROSCOPE ILLUMINATOR (model 150)

WORK STATIONS

COMPLETE WORK STATION (P/N 325)